Drop Shape Analysis System DSA100W
Automatic determination of contact angle and surface free energy on wafer
The DSA100W, the so-called wafer tester, is the optimal configuration for the automatic measurement of flat, round samples such as silicon wafers. With its built-in surface-mapping module the whole surface of up to a 12” wafer can be characterized. The determination of contact angles and surface free energy forms part of the combination.
Configuration of the DSA100W
Dosing | Software controlled single dosing system |
Camera | Standard camera |
Optics | Manual zoom / focus |
Illumination | Software controlled |
Axis | Software controlled z-axis |
Stage | Software controlled 300 mm wafer table |
Software | Software to determine static and dynamic contact angles |
Technical Data of the DSA100W
Max. sample size (WxDxH) | 300 x ∞ x 150 mm |
Dimension of sample (LxW) | 105 x 105 mm (Ø 300 mm) |
Range of |
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Range of |
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Optics |
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Video systems |
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Software | 5 different methods of drop shape analysis for Sessile Drop, automatic baseline for contact angle between 0 to 180°, option for curved baseline, Pendant Drop Method, video sequence, procedure definition, autodrop delivery, calculation of surface free energy according to Fowkes, extended Fowkes, Wu, Zisman, Owens-Wendt-Rabel, van Oss & Good, Neumann, calculation of Wetting envelopes, etc… |
Temperature range | -60 to 400°C |
Dimensions (WxDxH) | 620 × 380 × 610mm (954 x 380 x 610 mm for the long frame version) |
Weight | 25 to 45 kg |
Power supply | 110 to 240 VAC |
Interfaces | Optional connection to USB port of PC via adapter |
* Referring to image analysis |



